When selecting an electret condenser microphone (ECM), the packaging type plays a key role in determining the assembly method, production efficiency, and long-term reliability. The three most common packaging styles are:
- Pin Type
- SMD (Surface-Mount Device) Type
- Wire Type
This article compares their structural features, compatible assembly processes, and common applications—helping engineers and buyers select the right microphone structure for their needs.
1. Pin Type
Features:
- Equipped with two or three metal pins
- Designed for through-hole mounting (THT)
- Available in vertical or horizontal mounting styles
Assembly Method:
Wave soldering or manual insertion, compatible with traditional PCBA processes.
Typical Applications:
Two-way radios, conference microphones, recording pens, landline phones, security systems. View Pin Type Products
Advantages:
- Cost-effective and reliable
- Compatible with most standard PCBs
- Strong mechanical connection, easy to replace
2. SMD Type
Features:
- Flat terminals on the bottom, no extended pins
- Designed for automated pick-and-place and reflow soldering
- Compact design suitable for miniaturized products
Assembly Method:
SMT (Surface Mount Technology)
Typical Applications:
Bluetooth headsets, smart wearables, laptops, voice modules, AI speakers. View SMD Type Products
Advantages:
- Ideal for full automation
- Excellent consistency and repeatability
- Perfect for small-size, high-volume devices
3. Wire Type
Features:
- Pre-attached wire leads (e.g., red/black or white/blue)
- Direct connection to circuit or connector
Assembly Method:
Manual soldering or cable integration
Typical Applications:
Headsets, helmet intercoms, vehicle systems, custom modules, medical devices. View Wire Type Products
Advantages:
- Flexible installation in tight spaces
- Easy integration into customized wiring harnesses
Summary Table
| Packaging Type | Assembly Method | Automation | Common Sizes | Application Focus | Advantages Summary |
|---|---|---|---|---|---|
| Pin | Through-hole (THT) | Medium | 6mm, 9.7mm, 10mm | Traditional & industrial use | Cost-effective, highly reliable, easy to replace |
| SMD | SMT/Reflow | High | 4mm, 6mm | Smart/compact electronics | Excellent consistency, ideal for mass production, space-saving |
| Wire | Manual/Cable | Low | 6mm, 9.7mm | Custom, space-constrained use | Flexible wiring, fits complex structures |
Selecting the right microphone package depends on your product structure, assembly line, and performance expectations. As a microphone component manufacturer, we provide various packaging options and support automated production to ensure product consistency and quality.
Need help choosing the right package or model? Contact us for technical advice or sample support.
